2025 IEEE 16th International Conference on ASIC

Oct. 21-24, 2025, Crowne Plaza Hotel, Kunming, China

Invited Talks

Name Affiliation Country/Region Topic

Yasuhiko  Arakawa

University of Tokyo Japan

(TBD)

Koji Asami

University of Tokyo Japan

Signal Processing Techniques for Testing Wireless Communication LSIs

Francis Balestra CNRS-Grenoble INP-Sinano Institute France Future devices for high performance and low power operation
Jinshun Bi Guizhou Normal University_ China Fabrication and Performance Optimization of IGZO Devices Aiming at Space Application 
Yimao Cai Peking University China (TBD)
Yu Cao University of Minnesota USA Heterogeneous Integration for AI Computing
Zheng Chai Xi'an JiaoTong University China Generation, modulation and application
of spintronic Markov chain signal"
Mansun Chan Hong Kong University of Science and Technology Hong Kong, China Technology Options for Complementary Field Effect Transistor (CFET) Circuits
Jiezhi Chen Shandong University China On the Reliability of Sub-10nm Ultra-thin Ferroelectric HZO Thin Film
Ran   Cheng Zhejiang University China A device-to-circuit implementation of the high performance low temperature chips from the engineering perspective
Yasuo Cho Tohoku University Japan Scanning nonlinear dielectric microscopy for developing next-generation high-performance electronic devices
Li  Du Nanjing University China (TBD)
Peng Feng  Institute of Semiconductors,  Chinese Academy of Sciences China Recent Development of High Speed CMOS Image Sensors
Minoru Fujishima Hiroshima University Japan A Single-Chip 300-GHz-Band Transceiver Using a CMOS Phased Array with Two-Dimensional Beam Steering Capability
Mingqiang Guo University of Macau Macau, China Time-Domain vs. Voltage-Domain ADCs: Trade-offs in High-Speed Applications__

Koutaro Hachiya

Teikyo Heisei University Japan

(TBD)

Yuhui He Huazhong University of Science and Technology China Stacked 2D materials Nanopore Sensors
Qianqian Huang Peking University China Ultra-low power complementary tunneling transistors based on standard CMOS platform_and their applications
Makoto Ikeda University of Tokyo Japan Hardware Accelerator design for Functional Encryption
Mahfuzul Islam Institute of Science Tokyo Japan High-speed and energy-efficient true random number generator based on a self-compensating mechanism
Anquan Jiang Fudan University China A Low-temperature ferroelectric domain wall memory

Shyh-Jye Jerry Jou

Yang Ming Chiao Tung University Taiwan, China

An Hardware-Efficient Doppler Estimation and Compensation in PDSCH for 5G Non-Terrestrial Networks

Mineo Kaneko Japan Advanced Institute of Science and Technology Japan (TBD)
Haruo Kobayashi Gunma University Japan Noise Notch Frequency Design for EMI Mitigation in DC-DC Converters Using Delta-Sigma Modulation
Moufu Kong University of Electronic Science and Technology of China China SiC/GaN/Ga2O3 high-voltage power devices
Jing Li University of Electronic Science and Technology of China China (TBD)
Yibo Lin Peking University China ATSim: Thermal Simulation Framework for 2.5D/3D Chiplet Integration Systems with Application to Thermal Optimization
Xiaoyan  Liu Peking University China (TBD)
Liyuan Liu Institute of Semiconductors, Chinese Academy of Sciences China Vision Chips
Ye Lu Fudan University China The Generative Design of Analog and Radio Frequency Integrated Circuits
Wayne Luk Imperial College UK domain-specific AI hardware acceleration
Yufei Ma Peking University China Optimization of Mapping Strategies for AI Accelerators with Multiple Computing-in-Memory Macros.

Nobuhiko Nakano

Keio  University  Japan

(TBD)

Wai Tung Ng University of Toronto Canada Smart Gate Drive ICs for WBG Power Transistors
Yong-Young Noh Pohang University of Science and Technology Korea Development of high-performance p-type
Transistors
Xizhu Peng University of electronic science and technology of China China Back ground calibration technique with fast convergence speed for TI ADCs
Hao  Qiu Nanjing University China (TBD)
Yiming Qu East China Normal University China (TBD)
Zhiqiang(Walkie) Que Imperial College UK (TBD)
Francois RIVET Univ. Bordeaux France The Sequency Domain: an Opportunity for Future
AI-enhanced Radio Frequency Circuits and Systems
Youhua Shi  Waseda University Japan (TBD)
Xin Si Southeast University China Challenges and Trends of Floating-Point Computing-in-Memory Circuits
Hongfei  Su Tianjin University China An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
Viktor Sverdlov Institute for Microelectronics, TU Wien Austria Emerging magnetoresistive memories: Modeling and simulation apprioach
He Tang University Of Electronic Science And Technology Of China China (TBD)
Toru Tanzawa Waseda University Japan Power management circuit for energy harvesting
Akira Tsuchiya University of Shiga Prefecture Japan Liquid shape sensor for digital microfluidic system
Jing Wan Fudan University China Si-2D heterointegration and its applications
Chua-Chin Wang Sun Yat-Sen University Taiwan, China CMOS-based Active Gate Drive Circuit with User-Defined Miller Drive Strength Profiles and High Resolution DPWM Circuit Design
Changjin Wang Nanjin University China Oxide-based spiking neuron for neuromorphic perceptual and computing
Qi Wang Fudan University China Improving EUV Patterning Fidelity and Aberration Control through Source-Mask Co-Optimization
Albert Wang University of California, Riverside USA (TBD)
Runsheng Wang Peking University China The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization
Yan Wang Tsinghua University China Characterization and Modeling Methods for Power and RF GaN HEMTs
Xing Wu East China Normal University China (TBD)
Heng Wu Peking University China TBD (Tentative one: Opportunities and Innovations for Logic Technology with Dualsided Integrations)
Chunlei Wu Fudan University China An Analytical Model for Extremely Scaled Gate-All-Around Tunnel Transistors and Its Implications on the Scaling Theory
Yu Xiao Xidian University Hangzhou Institute of Technology China Enhancement of HfO₂-Based Ferroelectric Thin Film Performance via Interface and Defect Engineering​
Sixing Xiong Zhejiang University China (TBD)
Xiaoyong Xue Fudan University China Accelerating LLMs in Hybrid CIM Systems in Edge Devices
Jie Yang Westlake University China Towards general-purpose neuromorphic Systems: from Alogrithm to Silicon Deployment
Kiat Seng  Yeo Singapore University of Technology and Design Singapore An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
You Yin Gunma University Japan Phase change memory
Tomyouki Yokota University of Tokyo Japan Flexible organic electronics for the biosignal measurement
Bei  YU Chinese University of Hong Kong Hong Kong, China Accelerated Lithography Simulator for Large-Scale Layouts
Hongyu  Yu southern university of science and technology China (TBD)
Shuangming Yu Institute of Semiconductors, Chinese Academy of Sciences China Full-spiking bio-inspired target detection vision algorithm based on attention prediction mechanism for DVS and SPAD sensors
Bo Zhang University of Electronic Science and Technology of China China Advanced Gate Driver Solutions for Fast-Switching SiC Power Device Applications
Yi Zhao East China Normal University China (TBD)
Changjian Zhou South China University of Technology China Boosting the self-driven properties of 2D materials-based photodetectors via asymmetrical device engineering
Zekun  Zhou University of Electronic Science and Technology of China China High-efficiency Power Extraction Interface for Piezoelectric Energy Harvesting

Update by: 2025-06-03