Invited Talks

Name	Affiliation	Country/Region	Topic
Koji Asami	University of Tokyo	Japan	Some Signal Processing Techniques for Testing Wireless Communication LSIs
Francis Balestra	CNRS-Grenoble INP-Sinano Institute	France	Future devices for high performance and low power operation
Jinshun Bi	Guizhou Normal University_	China	Fabrication and Performance Optimization of IGZO Devices Aiming at Space Application
Yimao Cai	Peking University	China	High-density and High-reliability (H²DR) RRAM for Energy-efficient AI Computing
Yu Cao	University of Minnesota	USA	Heterogeneous Integration for AI Computing
Zheng Chai	Xi'an JiaoTong University	China	Generation, modulation and application of spintronic Markov chain signal"
Mansun Chan	Hong Kong University of Science and Technology	Hong Kong, China	Technology Options for Complementary Field Effect Transistor (CFET) Circuits
Jiezhi Chen	Shandong University	China	On the Reliability of Sub-10nm Ultra-thin Ferroelectric HZO Thin Film
Ran Cheng	Zhejiang University	China	A device-to-circuit implementation of the high performance low temperature chips from the engineering perspective
Yasuo Cho	Tohoku University	Japan	Scanning nonlinear dielectric microscopy for developing next-generation high-performance electronic devices
Yann Deval	University of Bordeaux	Franch	THE IMPACT OF BACK-GATE BIASING AND LAYOUT ON TEMPERATURE SENSITIVITY OF TRANSISTORS IN FD-SOI CMOS TECHNOLOGY
Zuoyuan Dong	East China Normal University	China	Microstructural Evolution and Reliability Analysis of RDL Copper Interconnects under HighTemperature Conditions
Li Du	Nanjing University	China	RAC-NAF: A Reconfigurable Analog Circuitry for Nonlinear Activation Function Computation in Computing-in-Memory
Peng Feng	Institute of Semiconductors, Chinese Academy of Sciences	China	Recent Development of High Speed CMOS Image Sensors
Minoru Fujishima	Hiroshima University	Japan	A Single-Chip 300-GHz-Band Transceiver Using a CMOS Phased Array with Two-Dimensional Beam Steering Capability
Mingqiang Guo	University of Macau	Macau, China	Time-Domain vs. Voltage-Domain ADCs: Trade-offs in High-Speed Applications__
Koutaro Hachiya	Teikyo Heisei University	Japan	Success Rate Improvement of Analog Circuit Topology Generation by Large Reasoning Models
Yuhui He	Huazhong University of Science and Technology	China	Stacked 2D materials Nanopore Sensors
Qianqian Huang	Peking University	China	Ultra-low power complementary tunneling transistors based on standard CMOS platform_and their applications
Makoto Ikeda	University of Tokyo	Japan	Hardware Accelerator design for Functional Encryption
Mahfuzul Islam	Institute of Science Tokyo	Japan	High-speed and energy-efficient true random number generator based on a self-compensating mechanism
Zhigang Ji	Shanghai Jiao Tong University	China	Reliability Screening for Yield Improvement in IC Design Industry: Progress, Challenges and Prospects
Anquan Jiang	Fudan University	China	A Low-temperature ferroelectric domain wall memory
Shyh-Jye Jerry Jou	Yang Ming Chiao Tung University	Taiwan, China	An Hardware-Efficient Doppler Estimation and Compensation in PDSCH for 5G Non-Terrestrial Networks
Mineo Kaneko	Japan Advanced Institute of Science and Technology	Japan	Coding Schemes of Carry Propagation Structures for Generating and Optimizing Parallel Prefix Adders
Haruo Kobayashi	Gunma University	Japan	Noise Notch Frequency Design for EMI Mitigation in DC-DC Converters Using Digital-to-Time Converter
Moufu Kong	University of Electronic Science and Technology of China	China	SiC/GaN/Ga2O3 high-voltage power devices
Jing Li	University of Electronic Science and Technology of China	China	A Pitch-Matched Transceiver ASIC with Element ADC and Continuous-Time Gain Compensation for 3D Ultrasound Probes
Yanli Li	Fudan University	China	Improving EUV Patterning Fidelity and Aberration Control through Source-Mask Co-Optimization
Yibo Lin	Peking University	China	ATSim: Thermal Simulation Framework for 2.5D/3D Chiplet Integration Systems with Application to Thermal Optimization
Xiaoyan Liu	Peking University	China	FD SOI-Based 1-T Image Sensor for IN-Pixel Computing
Liyuan Liu	Institute of Semiconductors, Chinese Academy of Sciences	China	Vision Chips
Ye Lu	Fudan University	China	The Generative Design of Analog and Radio Frequency Integrated Circuits
Wayne Luk	Imperial College	UK	domain-specific AI hardware acceleration
Yufei Ma	Peking University	China	Optimization of Mapping Strategies for AI Accelerators with Multiple Computing-in-Memory Macros.
Nobuhiko Nakano	Keio University	Japan	Self-Powered Chips Integrating On-Chip Solar Cells in Standard CMOS Technology
Wai Tung Ng	University of Toronto	Canada	Smart Gate Drive ICs for WBG Power Transistors
Yong-Young Noh	Pohang University of Science and Technology	Korea	Development of high-performance p-type Transistors
Xizhu Peng	University of electronic science and technology of China	China	Back ground calibration technique with fast convergence speed for TI ADCs
Hao Qiu	Nanjing University	China	Analysis and Design of Regulating Rectifier with Multiple Outputs for Wirelessly Powered Biomedical Devices
Yiming Qu	East China Normal University	China	Systematic Review of Write Reliability in Spin-Transfer Torque Magnetic Random-Access Memory
Zhiqiang (Walkie) Que	Imperial College	UK	Optimizing LLM inference for FPGAs
Francois Rivet	Univ. Bordeaux	France	The Sequency Domain: an Opportunity for Future AI-enhanced Radio Frequency Circuits and Systems
Youhua Shi	Waseda University	Japan	Breakdown-Aware Pre-Biasing for Highly Efficient Power Conversion in TENG-Based Energy Harvesting
Xin Si	Southeast University	China	Challenges and Trends of Floating-Point Computing-in-Memory Circuits
Hongfei Su	Tianjin University	China	An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
Viktor Sverdlov	Institute for Microelectronics, TU Wien	Austria	Emerging magnetoresistive memories: Modeling and simulation apprioach
Toru Tanzawa	Waseda University	Japan	Power management circuit for energy harvesting
Akira Tsuchiya	University of Shiga Prefecture	Japan	Liquid shape sensor for digital microfluidic system
Jing Wan	Fudan University	China	Si-2D heterointegration and its applications
Chua-Chin Wang	Sun Yat-Sen University	Taiwan, China	CMOS-based Active Gate Drive Circuit with User-Defined Miller Drive Strength Profiles and High Resolution DPWM Circuit Design
Changjin Wang	Nanjin University	China	Oxide-based spiking neuron for neuromorphic perceptual and computing
Qi Wang	Fudan University	China	Improving EUV Patterning Fidelity and Aberration Control through Source-Mask Co-Optimization
Albert Wang	University of California, Riverside	USA	ESD Reliability Roadmap Considerations for 3D Heterogeneous Integration Microsystems
Runsheng Wang	Peking University	China	The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization
Yan Wang	Tsinghua University	China	Characterization and Modeling Methods for Power and RF GaN HEMTs
Heng Wu	Peking University	China	Opportunities for Advanced Logic Technology with Dual-sided Integrations: From Lateral to Vertical Transistors
Chunlei Wu	Fudan University	China	Performance Benchmark of Gate-All-Around Nanosheets Transistors Based on DTCO Simulation
Yu Xiao	Xidian University Hangzhou Institute of Technology	China	Enhancement of HfO₂-Based Ferroelectric Thin Film Performance via Interface and Defect Engineering
Sixing Xiong	Zhejiang University	China	Interfacial Adhesion Enhancement Enabled Mechanically Durable Flexible Organic Optoelectronics
Xiaoyong Xue	Fudan University	China	Accelerating LLMs in Hybrid CIM Systems in Edge Devices
Jie Yang	Westlake University	China	Towards general-purpose neuromorphic Systems: from Alogrithm to Silicon Deployment
Kiat Seng Yeo	Singapore University of Technology and Design	Singapore	An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
You Yin	Gunma University	Japan	Phase change memory
Tomyouki Yokota	University of Tokyo	Japan	Flexible organic electronics for the biosignal measurement
Bei Yu	Chinese University of Hong Kong	Hong Kong, China	Accelerated Lithography Simulator for Large-Scale Layouts
Hongyu Yu	southern university of science and technology	China	Investigation of Threshold Voltage Instability in GaN HEMTs Using Rapid Ramp Sweeping Technique
Shuangming Yu	Institute of Semiconductors, Chinese Academy of Sciences	China	Full-spiking bio-inspired target detection vision algorithm based on attention prediction mechanism for DVS and SPAD sensors
Wenjian Yu	Tsinghua University	China	Advancing Sparse Matrix Solvers Via Exploring More Parallelism and Random Sketching
Bo Zhang	University of Electronic Science and Technology of China	China	Advanced Gate Driver Solutions for Fast-Switching SiC Power Device Applications
Weijia Zhang	Hong Kong University of Science and Technology	Hong Kong, China	Recent Design Trends of Gate Driver IC for WBG Power Devices
Bo Zhao	Zhejiang University	China	A Polar-Modulation Backscatter Technique
Changjian Zhou	South China University of Technology	China	Boosting the self-driven properties of 2D materials-based photodetectors via asymmetrical device engineering
Pingqiang Zhou	ShanghaiTech University	China	Fast Thermal-driven 3D Fixed-outline Floorplanning By Learning-based Thermal Analysis
Zekun Zhou	University of Electronic Science and Technology of China	China	High-efficiency Power Extraction Interface for Piezoelectric Energy Harvesting
Xiaona Zhu	Fudan University	China	Multi-Vt Solutions in GAA and CFET Devices

Update by: 2025-9-10

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Prof. Huihua Yu (Conference Issue) Prof. FanYe (Paper Submission)

Email: asicon_org@fudan.edu.cn Email: fanye@fudan.edu.cn

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