2025 IEEE 16th International Conference on ASIC

Oct. 21-24, 2025, Crowne Plaza Hotel, Kunming, China

Invited Talks

Name Affiliation Country/Region Topic
Yasuhiko  Arakawa University of Tokyo Japan (TBD)
Francis Balestra CNRS-Grenoble INP-Sinano Institute France Future devices for high performance and low power operation
Jinshun Bi Guizhou Normal University_ China Fabrication and Performance Optimization of IGZO Devices Aiming at Space Application 
Yimao Cai Peking University China (TBD)
Yu Cao University of Minnesota USA Heterogeneous Integration for AI Computing
Zheng Chai Xi'an JiaoTong University China Generation, modulation and application
of spintronic Markov chain signal"
Mansun Chan Hong Kong University of Science and Technology Hog Kong, China Technology Options for Complementary Field Effect Transistor (CFET) Circuits
Jiezhi Chen Shandong University China On the Reliability of Sub-10nm Ultra-thin Ferroelectric HZO Thin Film
Li  Du Nanjing University China (TBD)
Minoru Fujishima Hiroshima University Japan A Single-Chip 300-GHz-Band Transceiver Using a CMOS Phased Array with Two-Dimensional Beam Steering Capability
Yuhui He Huazhong University of Science and Technology China Stacked 2D materials Nanopore Sensors
Makoto IKEDA University of Tokyo Japan Hardware Accelerator design for Functional Encryption
Makoto Ikeda University of Tokyo Japan  Hardware Accelerator design for Functional Encryption
Mahfuzul Islam Institute of Science Tokyo Japan High-speed and energy-efficient true random number generator based on a self-compensating mechanism
Anquan Jiang Fudan University China A Low-temperature ferroelectric domain wall memory
Haruo Kobayashi Gunma University Japan Noise Notch Frequency Design for EMI Mitigation in DC-DC Converters Using Delta-Sigma Modulation
Moufu Kong University of Electronic Science and Technology of China China SiC/GaN/Ga2O3 high-voltage power devices
(The topic will be determined before July 15th) 
Jing Li University of Electronic Science and Technology of China China (TBD)
Xiaoyan  Liu Peking University China (TBD)
Liyuan Liu Institute of Semiconductors, Chinese Academy of Sciences China Vision Chips
Ye Lu Fudan University China The Generative Design of Analog and Radio Frequency Integrated Circuits
Wayne Luk Imperial College UK domain-specific AI hardware acceleration
Wai Tung Ng University of Toronto Canada Smart Gate Drive ICs for WBG Power Transistors
Xizhu Peng University of electronic science and technology of China China Back ground calibration technique with fast convergence speed for TI ADCs
Hao  Qiu Nanjing University China (TBD)
Yiming Qu East China Normal University China (TBD)
Zhiqiang(Walkie) Que Imperial College UK (TBD)
Francois RIVET Univ. Bordeaux France The Sequency Domain: an Opportunity for Future
AI-enhanced Radio Frequency Circuits and Systems
Hongfei  Su Tianjin University China An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
He Tang University Of Electronic Science And Technology Of China China (TBD)
Akira Tsuchiya University of Shiga Prefecture Japan Liquid shape sensor for digital microfluidic system
Jing Wan Fudan University China Si-2D heterointegration and its applications
Chua-Chin Wang Sun Yat-Sen University Taiwan, China CMOS-based Active Gate Drive Circuit with User-Defined Miller Drive Strength Profiles and High Resolution DPWM Circuit Design
Changjin Wang Nanjin University China Oxide-based spiking neuron for neuromorphic perceptual and computing
Qi Wang Fudan University China Improving EUV Patterning Fidelity and Aberration Control through Source-Mask Co-Optimization
Albert Wang University of California, Riverside USA (TBD)
Xing Wu East China Normal University China (TBD)
Heng Wu Peking University China TBD (Tentative one: Opportunities and Innovations for Logic Technology with Dualsided Integrations)
Chunlei Wu Fudan University China An Analytical Model for Extremely Scaled Gate-All-Around Tunnel Transistors and Its Implications on the Scaling Theory
Kiat Seng  Yeo Singapore University of Technology and Design Singapore An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology
You Yin Gunma University Japan Phase change memory
Tomyouki Yokota University of Tokyo Japan Flexible organic electronics for the biosignal measurement
Bei  YU Chinese University of Hong Kong Hog Kong, China Accelerated Lithography Simulator for Large-Scale Layouts
Hongyu  Yu southern university of science and technology China (TBD)
Bo Zhang University of Electronic Science and Technology of China China Advanced Gate Driver Solutions for Fast-Switching SiC Power Device Applications
Yi Zhao East China Normal University China (TBD)
Xing Zhou Nanyang Technological University Singapore Compact Modeling for technology development and chip design
Changjian Zhou South China University of Technology China Boosting the self-driven properties of 2D materials-based photodetectors via asymmetrical device engineering
Changjian Zhou  Santa Clara University USA (TBD)

Update by: 2025-05-14