2023 IEEE 15th International Conference on ASIC

Oct. 24-27, 2023, Platinum Hanjue Hotel, Nanjing, China

General Co-Chairs
  • Jan Van der Spiegel
  • Zhiliang Hong
  • Yong Lian
  • Ting-Ao Tang
  • Yi Shi 
  • Hongxia Liu
  Advisory Committee Co-Chairs
  • Chenming Hu
  • Richard M.M.Chen
  • Hiroshi Iwai
  • Cor Claeys
  • Qianling Zhang
     
Program Committee Co-Chairs
  • Fan Ye
  • Xinran Wang
  • Francois Rivet
  • Haruo Kobayashi
  • Hidetoshi Onodera
  • Jyi-Tsong Lin
  • Yi Zhao
  Organizing Committee Co-Chairs
  • Mengqi Zhou
  • Huihua Yu

 

Publicity Chair

  • Rui Yin
  • Wei Xu
  • Jiting Sheng
  Publication Committee Chair

 

 

Secretary-General
  • Fan Ye

 

   

 

 

Technical Program Committee Members of ASICON 2023

Name

Affiliation

Country/Region

Analog and RF Circuits Subcommittee

Chen, Wei-Zen

Yang Ming Chiao Tung University

Taiwan, China

Lee, Tai-Cheng

Taiwan University

Taiwan, China

Zhang, Feng

Institute of Microelectronics, CAS

China

Kobayashi, Haruo

Gunma University

Japan

Simon, Ang

University of Arkansas

USA

Huang, Mo

University of Macau

Macao, China

Song, Fei

Ubilinx technology, Inc

USA

Wu, Nanjian

Institute of Semiconductor, CAS

China

Zhang, Wenjun

Intel

USA

Qi, Liang

Shanghai Jiaotong University

China

Song, Shuang

Zhejiang University

China

Chen, Chao

Delft University of Technology

Netherlands

Xiao, Zhiming

Nankai University

China

Gao, Hao

Eindhoven University of Technology

Netherlands

Digital Circuits and SOC Subcommittee

Qu, Gang          

University of Maryland

USA       

John, Deepu

University College Dublin

UK

Wang, Pengjun       

Wenzhou University

China

Liu, Dongsheng

Huazhong University of Science and Technology

China

Wang, Shaoyun

NextInputInc.

USA

Jerraya, Ahmed

CEA Tech

France

Wang, Chua-Chin

Sun Yat-Sen University

Taiwan, China

Sobelman, Gerald

University of Minnesota

USA

Gong, Na

University of South Alabama

USA

Jou, Shyh-Jye

Yang Ming Chiao Tung University

Taiwan, China

Sang, Tzu-Hsien

Yang Ming Chiao Tung University

Taiwan, China

Liu, Liang

Lund University

Sweden

Min, Kyeong-Sik

Kookmin University

Korea

Ikeda, Makoto

University of Tokyo

Japan

Yu, Zhiyi

Sun Yat-sen University

China

Wen, Xiaoqing

Kyushu Institute of Technology

Japan

Zhang, Chuan

Southeast University

China

CAD Techniques Subcommittee

Sheldon, Tan

University of California, Riverside

USA

Qu, Gang          

University of Maryland

USA       

Yu, Bei

Chinese University of Hong Kong

Hongkong, China

Jerraya, Ahmed

CEA Tech

France

Chan, Mansun          

Hong Kong University of Science and Technology

Hongkong, China

Wang, Xingang

Skyworks Solutions, Inc.

USA

Wen, Xiaoqing

Kyushu Institute of Technology

Japan

Process and Devices Subcommittee

Chang-Liao, Kuei-Shu

Tsing Hua University

Taiwan, China

LAI, Chao-Sung

Chang Gung University

Taiwan, China

Kobayashi Masaharu

The University of Tokyo

Japan

Chen, Kuan-Neng

Yang Ming Chiao Tung University

Taiwan, China

Jerraya, Ahmed

CEA Tech

France

Lee, Ching-Ting                  

Cheng Kung University/Yuan Ze University

Taiwan, China

Li, Pei-Wen              

Chiao Tung University

Taiwan, China

Zhao, Weisheng   

Beihang University

China

Simon, Ang

University of Arkansas

USA

Ng, Wai Tung

University of Toronto

Canada

Simoen, Eddy 

IMEC

Belgium

Endo, Kazuhiko 

Advanced Industrial Science and Technology (AIST)

Japan

Zhang, Jian Fu        

Liverpool John Moores University

UK

Zhang, Weidong      

Liverpool John Moores University 

UK

Xie, Ya-Hong

UCLA

USA

Kong, Moufu

University of Electronic Science & Technology of China

China