General Co-Chairs
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Advisory Committee Co-Chairs
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Program Committee Co-Chairs
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Organizing Committee Co-Chairs
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Publicity Chair
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Publication Committee Chair
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Secretary-General
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Technical Program Committee Members of ASICON 2023 |
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Name |
Affiliation |
Country/Region |
Analog and RF Circuits Subcommittee |
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Chen, Wei-Zen |
Yang Ming Chiao Tung University |
Taiwan, China |
Lee, Tai-Cheng |
Taiwan University |
Taiwan, China |
Zhang, Feng |
Institute of Microelectronics, CAS |
China |
Kobayashi, Haruo |
Gunma University |
Japan |
Simon, Ang |
University of Arkansas |
USA |
Huang, Mo |
University of Macau |
Macao, China |
Song, Fei |
Ubilinx technology, Inc |
USA |
Wu, Nanjian |
Institute of Semiconductor, CAS |
China |
Zhang, Wenjun |
Intel |
USA |
Qi, Liang |
Shanghai Jiaotong University |
China |
Song, Shuang |
Zhejiang University |
China |
Chen, Chao |
Delft University of Technology |
Netherlands |
Xiao, Zhiming |
Nankai University |
China |
Gao, Hao |
Eindhoven University of Technology |
Netherlands |
Digital Circuits and SOC Subcommittee |
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Qu, Gang |
University of Maryland |
USA |
John, Deepu |
University College Dublin |
UK |
Wang, Pengjun |
Wenzhou University |
China |
Liu, Dongsheng |
Huazhong University of Science and Technology |
China |
Wang, Shaoyun |
NextInput,Inc. |
USA |
Jerraya, Ahmed |
CEA Tech |
France |
Wang, Chua-Chin |
Sun Yat-Sen University |
Taiwan, China |
Sobelman, Gerald |
University of Minnesota |
USA |
Gong, Na |
University of South Alabama |
USA |
Jou, Shyh-Jye |
Yang Ming Chiao Tung University |
Taiwan, China |
Sang, Tzu-Hsien |
Yang Ming Chiao Tung University |
Taiwan, China |
Liu, Liang |
Lund University |
Sweden |
Min, Kyeong-Sik |
Kookmin University |
Korea |
Ikeda, Makoto |
University of Tokyo |
Japan |
Yu, Zhiyi |
Sun Yat-sen University |
China |
Wen, Xiaoqing |
Kyushu Institute of Technology |
Japan |
Zhang, Chuan |
Southeast University |
China |
CAD Techniques Subcommittee |
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Sheldon, Tan |
University of California, Riverside |
USA |
Qu, Gang |
University of Maryland |
USA |
Yu, Bei |
Chinese University of Hong Kong |
Hongkong, China |
Jerraya, Ahmed |
CEA Tech |
France |
Chan, Mansun |
Hong Kong University of Science and Technology |
Hongkong, China |
Wang, Xingang |
Skyworks Solutions, Inc. |
USA |
Wen, Xiaoqing |
Kyushu Institute of Technology |
Japan |
Process and Devices Subcommittee |
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Chang-Liao, Kuei-Shu |
Tsing Hua University |
Taiwan, China |
LAI, Chao-Sung |
Chang Gung University |
Taiwan, China |
Kobayashi, Masaharu |
The University of Tokyo |
Japan |
Chen, Kuan-Neng |
Yang Ming Chiao Tung University |
Taiwan, China |
Jerraya, Ahmed |
CEA Tech |
France |
Lee, Ching-Ting |
Cheng Kung University/Yuan Ze University |
Taiwan, China |
Li, Pei-Wen |
Chiao Tung University |
Taiwan, China |
Zhao, Weisheng |
Beihang University |
China |
Simon, Ang |
University of Arkansas |
USA |
Ng, Wai Tung |
University of Toronto |
Canada |
Simoen, Eddy |
IMEC |
Belgium |
Endo, Kazuhiko |
Advanced Industrial Science and Technology (AIST) |
Japan |
Zhang, Jian Fu |
Liverpool John Moores University |
UK |
Zhang, Weidong |
Liverpool John Moores University |
UK |
Xie, Ya-Hong |
UCLA |
USA |
Kong, Moufu |
University of Electronic Science & Technology of China |
China |