The 13^th International Conference on ASIC (ASICON 2019) will be held in Chongqing, China, during Oct. 29 - Nov. 1, 2019. The conference is intended to provide an international forum for VLSI circuit designers, ASIC users, System Integrators, IC manufacturers、Process & Device Engineers and   CAD/CAE tool developers to present their updated progresses, developments and research results in their respective fields. The four-day event features keynote speeches and invited talks on state-of-the-art VLSI circuit, device, process design and manufacturing technologies, regular paper presentations, as well as tutorials delivered by leading experts in the respective fields. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/Testing facilities, and novel ASIC products will be held during the conference.

Important dates

Paper submission deadline is June 30, 2019.