Technical Program Overview

ASICON 2011 Technical Program Overview

Date

Time

Sea-view Meeting
Rooms
6

Sea-view Meeting
Rooms
7

Sea-view Meeting
Rooms 8

Sea-view Meeting
Rooms
9

Oct.25
Tue.

AM 9:00

Tutorial Session T1 & T2

Tutorial Session T5

 

 

PM 2:00

Tutorial Session T3 & T4

 

 

 

Oct.26
Wed.

8:30—10:00

Opening & Keynote Session K1 (International Auditorium)

10:15-12:15

Keynote Session K2 & K5     (International Auditorium)

13:30-15:30

Session 4J:
Reference & Nyquist Analog-to-Digital Converters ()

Session 1F:
Advanced Memory ()

Session 1A:
VLSI Design and Circuits ()

Session 2R:
Wireless transceiver and building blocks ()

15:45-17:45

Special Session:
High-Level Synthesis

Session 2E:
Testing, Reliability, Fault-Tolerance ()

Session 2A:
VLSI Design and Circuits ()

Session 1O:
Clock Synthesizer and Building Blocks ()

17:45-18:45

Poster Session 1 ( Hall )

19:00-21:00

Reception

Oct.27
Thu.

8:30-10:00

Keynote Session K3 & K4 (International Auditorium)

10:15-12:15

Session 1J:
Analog Filters and Oversampling Data Converters

Session 2F:
Advanced Memory ()

Session 3A :
VLSI Design and Circuits ()

Session 2O:
Clock Synthesizer and Building Blocks ()

13:30-15:30

Session 3B:
Analog Techniques for Sensor Signal Conditioning

Session 1E:
Testing, Reliability, Fault-Tolerance ()

Session 1D :
Circuits and Systems for Wireless Communications ()

Session 1B:
Power Management ICs

15:45-17:45

Session 2J:
Nyquist Analog-to-Digital Converters ()

Session 1H:
CAD for system, Design for Manufacturing and Testing ()

Session 1R:
RF transceiver and building blocks ()

Session 3R:
Wireless transceiver and building blocks ()

17:45-18:45

Poster Session 2  ( Hall )

Oct.28
Fri.

10:15-12:15

Session 1K:
New Processing & Devices, Hetro-integration, 3-D integration ()

Session 2H:
CAD for system, Design for Manufacturing and Testing ()

Session 1N :
Other VLSI Device and Design related topics

Session 2B:
Analog Techniques ()

13:30-15:30

Session 2K:
New Processing & Devices, Hetro-integration, 3-D integration ()

Session 1G:
Circuits Simulation, Synthesis, Verification and Physical design ()

Session 1C : Application-Specific SoCs ()

Session 3J:
Nyquist Digital-to-Analog Converters

15:45-17:45

Session 1I:
MEMS technology, device and circuits

Session 2G:
Circuits Simulation, Synthesis, Verification and Physical design ()

Session 2C :
Application-Specific SoCs ()

 

19:00-21:00

Banquet

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