COMMITTE


General Co-Chairs

Jan Van der Spiegel, University of Pennsylvania, USA
Ting-Ao Tang, Fudan University, China
Yong LianYork UniversityCanada
Zhiliang Hong, Fudan University, China
Xiaoping Zeng, Chongqing University, China
 

Advisory Committee Co-Chairs

Chenming Hu, UC Berkeley, USA
Omar Wing, Colombia University, USA
Richard.M.M.Chen, IEEE HK Section, Hongkong
Hiroshi Iwai, Tokyo Institute of Technology, Japan
Satoshi GotoWaseda University, Japan
Qianling Zhang, Fudan University, China
 

Program Committee Co-Chairs

Yinyin Lin, Fudan University, China
Hidetoshi Onodera, Kyoto University, Japan
Bin Zhao, Fairchild, USA
Jyi-Tsong Lin, NSYSU, Taiwan, China
Francois Rivet, University of Bordeaux, France
Yi Zhao, Zhejiang University, China
 

Organizing Committee Co-Chairs

Mengqi Zhou, IEEE Beijing Section, China
Huihua Yu, Fudan University, China
Min Liu, Chongqing University, China
 

Industry Liaison

Peng Hu, CICMAG Com., China
 

Publicity Chair

Mengqi Zhou, IEEE Beijing Section, China
 

Secretary-General

Fan Ye, Fudan University, China
 

Technical Program Committee Members of ASICON 2019

Analog and RF Circuits Subcommittee

Chen, Weizen

National Chiao Tung University

Taiwan

Huang, Mo

South China University of Technology

China

Lee, Tai-Cheng

National Taiwan University

Taiwan

Zhang, Feng

institute of microelectronics, CAS

China

Kobayashi, Haruo

Gunma University

Japan

Simon, Ang

University of Arkansas

USA

Song, Fei

Ubilinx technology, Inc

USA

Wu, Nanjian

Institute of Semiconductor, CAS

China

Zhang, Wenjun

Intel

USA

Digital Circuits and SOC Subcommittee

Zhang, Wenjun

Intel

USA

Qu, Gang          

University of Maryland

USA       

John, Deepu

University College Dublin

Ireland

Wang, Pengjun       

Wenzhou University

China

Liu, Dongsheng

Huazhong University of Science and Technology

China

Wang, Shaoyun

NextInputInc.

USA

Jerraya, Ahmed

CEA Tech

France

Wang, Chua-Chin

National Sun Yat-Sen University

Taiwan

Sobelman, Gerald

University of Minnesota

USA

Gong, Na

University of South Alabama

USA

Jou, Shyh-Jye

National Chiao Tung University

Taiwan

Sang, Tzu-Hsien

National Chiao Tung University

Taiwan

Liu, Liang

Lund University

Sweden

Min, Kyeong-Sik

Kookmin University

Korea

Ikeda, Makoto

University of Tokyo

Japan

Yu, Zhiyi

Sun Yat-sen University

China

Wen, Xiaoqing

Kyushu Institute of Technology

Japan

Zhang, Chuan

Southeast University

China

CAD Techniques Subcommittee

Sheldon, Tan

University of California, Riverside

USA

Qu, Gang          

University of Maryland

USA       

Yu, Bei

Chinese University of Hong Kong

China

Jerraya, Ahmed

CEA Tech

France

Chan, Mansun          

Hong Kong University of Science and Technology

China

Wang, Xingang

Skyworks Solutions, Inc.

USA

Wen, Xiaoqing

Kyushu Institute of Technology

Japan

Process and Devices Subcommittee

Chang-Liao, Kuei-Shu

National Tsing Hua University

Taiwan

LAI, Chao-Sung

Chang Gung University

Taiwan

Kobayashi Masaharu

The University of Tokyo

Japan

Chan, Mansun          

Hong Kong University of Science and Technology

China

Chen, Kuan-Neng

National Chiao Tung University

Taiwan

Jerraya, Ahmed

CEA Tech

France

Lee, Ching-Ting                  

National Cheng Kung University/Yuan Ze University

Taiwan

Li, Pei-Wen              

National Chiao Tung University

Taiwan

Zhao, Weisheng   

Beihang University

China

Simon, Ang

University of Arkansas

USA

Ng, Wai Tung

University of Toronto

Canada

Simoen, Eddy 

IMEC

Belgium

Endo, Kazuhiko 

Advanced Industrial Science and Technology (AIST)

Japan

Zhang, Jian Fu        

Liverpool John Moores University

UK

Zhang, Weidong      

Liverpool John Moores University 

UK

Xie, Ya-Hong

UCLA

USA


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